Поиск на сайте: laster middle layer low temperature 158℃ chip 183℃ lead free solder paste suitable for motherboard middle layer and chip repair
1. Ultra-fine steel wire: high hardness, not easy to deform at high temperatures, with heating equipment to use, in addition to the tin to remove the glue more quickly and effectively (chips need to be heated and cleaned)2. Pig sideburns hair: high elasticity without hair loss, fast cleaning motherboard chips, anti-static non-destructive operation more at ease (in use, please do not brush the chip with excessive force to avoid damage to the motherboard chip)3. Brush head for screw-twist installation, can be replaced to expand 4. Fountain pen class design, bag non-slip texture, flexible operation, comfortable grip 5. Handle using magnesium silicon steel, durable, anti-corrosion and rust, smooth and easy to clean 6. Use: for motherboard chip de-gumming / IC pad cleaning 7. Size: about 13 x 1cm 8. Weight: about 15g
